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Audio chip
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ESD testing (HBM)
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CJC8910
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CJC8990
Application description
Audio chip
Capacitive touch chip
MCU
Power management IC
ASIC standard/custom development
Product Demo
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Third party testing report
ESD testing (HBM)
Temperature and Humidity Cycle (TCT)
High and Low Temperature Testing (L/HTSL)
Update Notice
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Third party testing report
Main Control Zone
CJC8910
CJC6811A
CJC8988
CJC8990
Application description
Audio chip
Capacitive touch chip
MCU
Power management IC
ASIC standard/custom development
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ESD testing (HBM)
Temperature and Humidity Cycle (TCT)
High and Low Temperature Testing (L/HTSL)
Update Notice
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CJC8910
CJC6811A
CJC8988
CJC8990
Application description
Audio chip
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MCU
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ASIC standard/custom development
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Third party testing report
> ESD testing (HBM)
CJC6811A_LTSL_-55℃ 12H
release time:2023-03-16
publisher:
CJC6811A_ Temperature and humidity cycle test report
CJC6811A_LTSL_12H
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